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Market Cap.:7.8 B
M
Market Capitalization - Sizes
Here you can see how we classify a market capitalization.
XS
< 100 Mil.
S
> 100 Mil.
M
> 1 Bil.
L
> 10 Bil.
XL
> 100 Bil.
P/E:20.82
x30.14Industry Within Country Benchmark (IWCB)
The multiplier shows you the relation between a reported metric, e.g. Earnings Per Share (EPS)
and the μ EPS value of the corporate's industry.
We exclude other countries from the average calculation in order to
take into account the specific economic and regulatory conditions in that country.
Concrete for "Semiconductors" in United States
EPS: 4.9283,
P/E: 30.1352
EPS:1.52
x
3.24
Industry Within Country Benchmark (IWCB)
The multiplier shows you the relation between a reported metric, e.g. Earnings Per Share (EPS)
and the μ EPS value of the corporate's industry.
We exclude other countries from the average calculation in order to
take into account the specific economic and regulatory conditions in that country.
Concrete for Semiconductors in United States
EPS: 4.9283,
P/E: 30.1352
Earnings Call
1 month, 1 week from now
Dividend Waiting Time
We compute the average time difference between dividend payments
and assign an indicator that holds a general grade for that frequency.
Low
Average time between dividend payments is less than 3 months.
Neutral
Average time between dividend payments is between 3 to 6 months.
High
Average time between dividend payments is more than 6 months.
n.A.
Latest Dividends History
Each bar represents a dividend payment made within the last 12 months, with the bar's height relative to the maximum dividend paid within that timeframe.
See all Dividends.
Volume LevelVolume Deviation Rating System (VDRS)
We compare the 15-minute delayed volume to the average volume and grade the percentual deviation.
High
Deviation >= 20%
Moderate High
Deviation between 10% to 20%
Moderate
Deviation between -10% to 10%
Moderate Low
Deviation between -20% to -10%
Low
Deviation between <= -20%
μ 1,850,176
1,600,880
Moderate Low
Performance Ranks (Intraday)A system to benchmark AMKR's relative intraday performance.
Each star represents "20% have worse results", e.g. 4/5 stars symbolize that the corporate had a better result than 80% of the benchmark compotion.
United States:
104th
out of
2160
Technology:
97th
out of
1086
Semiconductors:
16th
out of
116
Peer Group:
2nd
out of
12
About
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices;
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including …
About
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices;
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including …
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